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 To all our customers
Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp. Customer Support Dept. April 1, 2003
Cautions
Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
2SC2855, 2SC2856
Silicon NPN Epitaxial
ADE-208-1079 (Z) 1st. Edition Mar. 2001 Application
* Low frequency low noise amplifier * Complementary pair with 2SA1190 and 2SA1191
Outline
TO-92 (1)
1. Emitter 2. Collector 3. Base 3 2 1
2SC2855, 2SC2856
Absolute Maximum Ratings (Ta = 25C)
Item Collector to base voltage Collector to emitter voltage Emitter to base voltage Collector current Emitter current Collector power dissipation Junction temperature Storage temperature Symbol VCBO VCEO VEBO IC IE PC Tj Tstg 2SC2855 90 90 5 100 -100 400 150 -55 to +150 2SC2856 120 120 5 100 -100 400 150 -55 to +150 Unit V V V mA mA mW C C
2SC2855, 2SC2856
Electrical Characteristics (Ta = 25C)
2SC2855 Item Collector to base breakdown voltage Collector to emitter breakdown voltage Emitter to base breakdown voltage Collector cutoff current Emitter cutoff current DC current transfer ratio Collector to emitter saturation voltage Symbol Min V(BR)CBO V(BR)CEO V(BR)EBO I CBO I EBO hFE*
1
2SC2856 Max Min -- -- -- 0.1 0.1 800 120 120 5 -- -- 250 Typ -- -- -- -- -- -- Max Unit -- -- -- 0.1 0.1 800 V V V A A Test conditions I C = 10 A, IE = 0 I C = 1 mA, RBE = I E = 10 A, IC = 0 VCB = 70 V, IE = 0 VEB = 2 V, IC = 0 VCE = 12 V, IC = 2 mA*2 I C = 10 mA, IB = 1 mA*2
Typ -- -- -- -- -- --
90 90 5 -- -- 250 -- -- -- -- -- --
VCE(sat)
0.05 0.10 -- 0.7 310 3 1.0 -- -- -- -- -- -- -- --
0.05 0.10 V 0.7 310 3 1.0 -- -- V MHz pF dB dB
Base to emitter saturation VBE(sat) voltage Gain bandwidth product Collector output capacitance Noise figure fT Cob NF
VCE = 6 V, IC = 10 mA VCB = 10 V, IE = 0, f = 1 MHz VCE = 6 V, IC = 0.1 mA, Rg = 10 k, f = 1 kHz VCE = 6 V, IC = 0.1 mA, Rg = 10 k, f = 10 Hz
0.15 1.5 0.2 0.7 2.0 --
0.15 1.5 0.2 0.7 2.0 --
Noise voltage referred to input
en
--
nV/Hz VCE = 6 V, IC = 10 mA, Rg = 0, f = 1 kHz
Notes: 1. The 2SC2855 and 2SC2856 are grouped by h FE as follows. 2. Pulse test D 250 to 500 E 400 to 800
2SC2855, 2SC2856
Maximum Collector Dissipation Curve Collector Power Dissipation PC (mW) 600 20 Typical Output Characteristics
26 24 22
20 18 16 14 12 10
400
Collector Current IC (mA)
16
PC
12
= 0 40 m W
8
200
4
8 6 4 2 A IB = 0
0
50 100 Ambient Temperature Ta (C)
150
0
20 40 60 80 100 Collector to Emitter Voltage VCE (V)
Typical Output Characteristics 10
Typical Transfer Characteristics 100 Collector Current IC (mA) VCE = 6 V Pulse Ta = 75C 10 25C -25C 1.0
18
Collector Current IC (mA) 8
16 14
6
12
10 8
4
6
2
4 2 A
IB = 0
0 4 8 12 16 20 Collector to Emitter Voltage VCE (V)
0.1 0 0.2 0.4 0.6 0.8 1.0 Base to Emitter Voltage VBE (V)
2SC2855, 2SC2856
Collector Cut-Off Current vs. Collector to Base Voltage 1,000 Collector Cut-Off Current ICBO (pA)
75 C
Collector Cut-Off Current vs. Collector to Emitter Voltage 1,000 Collector Cut-Off Current ICEO (nA)
100
Ta
=
25
-25
100
Ta
=7
5C
25
10
10
-25
1.0
1.0
0.1 0 20 40 60 80 100 Collector to Base Voltage VCB (V)
0.1 0 20 40 60 80 100 Collector to Emitter Voltage VCE (V)
Emitter Cut-Off Current vs.Emitter to Base Voltage Collector to Emitter Breakdown Voltage V(BR)CER (V) 1,000 Emitter Cut-Off Current IEBO (pA) 190
Collector to Emitter Breakdown Voltage vs. Base to Emitter Resistance Typical Value IC = 1 mA
C
100
Ta
=
75
180
25
170
-2
10
5
160
1.0
150
0.1 0 2 4 6 8 Emitter to Base Voltage VEB (V) 10
140 10
100 1k 10 k 100 k Base to Emitter Resistance RBE ()
2SC2855, 2SC2856
DC Current Transfer Ratio vs. Collector Current Ta = 75C 25 -25 Collector to Emitter Saturation Voltage VCE(sat) (V) 1,000 DC Current Transfer Ratio hFE Collector to Emitter Saturation Voltage vs. Collector Current 1.0 Pulse IC = 10 IB 0.3
300
100
0.1 Ta = 75C 0.03 25 -25
30 VCE = 12 V Pulse 10 1 3 10 30 Collector Current IC (mA) 100
0.01 1 3 10 30 Collector Current IC (mA) 100
Base to Emitter Saturation Voltage vs. Collector Current 10 Base to Emitter Saturation Voltage VBE(sat) (V) Gain Bandwidth Product fT (MHz) Pulse IC = 10 IB 3 1,000
Gain Bandwidth Product vs. Collector Current VCE = 6 V 500
200 100 50
1.0
Ta =-25C
75 25
0.3
20 10 0.5
0.1 1 3 10 30 Collector Current IC (mA) 100
1.0 2 5 10 20 Collector Current IC (mA)
50
2SC2855, 2SC2856
Collector Output Capacitance vs. Collector to Base Voltage Collector Output Capacitance Cob (pF) 100 Noise Voltage Referred to Input en (nV/ Hz) IE = 0 f = 1 MHz 30 10 VCE = 6 V Rg = 0 f = 1 kHz 3 Noise Voltage Referred to Input vs. Collector Current
10
1.0
3
0.3
1 1 3 10 30 100 Collector to Base Voltage VCB (V)
0.1 0.1
0.3 1.0 3 Collector Current IC (mA)
10
Noise Voltage Referred to Input vs. Signal Source Resistance 1,000 Noise Voltage Referred to Input en (nV/ Hz) Noise Voltage Referred to Input en (nV/ Hz) VCE = 6 V f = 1 kHz 100 1.0
Noise Voltage Referred to Input vs. Collector to Emitter Voltage
0.9
IC
10
=
10
m
A
0 1.
1 0.
0.8
0.7 IC = 1 mA Rg = 0 f = 1 kHz 1 3 10 30 100 Collector to Emitter Voltage VCE (V)
1.0
0.6
0.1 10
0.5 100 1k 10 k 100 k Signal Source Resistance Rg ()
2SC2855, 2SC2856
Noise Voltage Referred to Input vs. Frequency 2.0 Noise Voltage Referred to Input en (nV/ Hz) VCE = 6 V Rg = 0 1.6
1.2 IC = 1 mA 10 0.4
0.8
0 10
100 1k 10 k Frequency f (Hz)
100 k
2SC2855, 2SC2856
Package Dimensions As of January, 2001
Unit: mm
4.8 0.4
3.8 0.4
2.3 Max 0.55Max 0.7 0.60 Max
12.7 Min
5.0 0.2
0.5Max
1.27 2.54
Hitachi Code JEDEC EIAJ Mass (reference value)
TO-92 (1) Conforms Conforms 0.25 g
2SC2855, 2SC2856
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica Europe Asia Japan
: : : :
http://semiconductor.hitachi.com/ http://www.hitachi-eu.com/hel/ecg http://sicapac.hitachi-asia.com http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd. Hitachi Tower 16 Collyer Quay #20-00, Singapore 049318 Tel : <65>-538-6533/538-8577 Fax : <65>-538-6933/538-3877 URL : http://www.hitachi.com.sg Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road, Hung-Kuo Building, Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon, Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : http://www.hitachi.com.hk
For further information write to:
Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic Components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585160
Copyright (c) Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Colophon 2.0


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